Anodic Bonding Glass To Metal. In this state the glass becomes highly reactive. This bonding technique also known as field assisted bonding or electrostatic sealing is mostly used for connecting siliconglass.
Figure 9 From Investigation Of Au Si Eutectic Wafer Bonding For Mems Accelerometers Semantic Scholar from www.semanticscholar.org
By applying a DC potential up to 1kV an electric field is created causing sodium ions to deplete the surface of the glass and to diffuse into the Silicon. The anodic bonding of various conductive materials to glass was realized successfully for the first time in 1969 by Wallis and Pomerantz 1969. Their license was verified as active when we last checked.
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Due to the influence of welding temperature the metal ion moves from the anode side to the cathode side which forms an electric circuit. For 5 minutes at 400 C. The final step in the process is the electroplating operation itself. Solar Energy Materials and Solar Cells 2011 95 11 3001-3008.
